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8. IC Packaging

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Moldex3D IC Packaging can predict wire sweep and lead frame deformation phenomena during IC package process, and also connect with other FEA software for further structural analysis. In addition, Moldex3D IC Packaging can do six different IC package process simulations: Transfer Molding, Capillary Underfill, Molded Underfill, Compression Molding, Embedded Wafer Level Package, No Flow Underfill, and Non-Conductive Paste.