Thermal Induced Residual Stress
This result shows XX-component of the thermal residual stress tensor of the ejected part.
Thermal induced residual stress is caused by non-uniform volumetric shrinkage. Higher value of thermal induced residual stress will cause void defect.
You can modify the cooling system to eliminate non-uniform volumetric shrinkage and further reduce thermal induced residual stress.
Thermal Stress Von-Mises
Von-Mises thermal residual stress of the ejected part.