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Moldex3D Help 2021

Moldex3D IC Packaging can predict wire sweep and lead frame deformation phenomena during IC package process, and also connect with other FEA software for further structural analysis. In addition, Moldex3D IC Packaging can do six different IC package process simulations: Transfer Molding, Capillary Underfill, Molded Underfill, Compression Molding, Embedded Wafer Level Package, No Flow Underfill, and Non-Conductive Paste.

IC processes that Moldex3D supports:

Moldex3D Module

Analysis Type

Supported Processing

Transfer Molding

Transfer Molding

Transfer Molding

Compression Molding

Compression Molding

Compression Molding

Embedded Wafer Level Package

Embedded Wafer Level Package (eWLP)

Wafer Level Molded Underfill (WUF / WLUF)

No Flow Underfill / Non-Conductive Paste

No Flow Underfill (NUF)

Non-Conductive Paste (NCP)

Non-Conductive Film (NCF)

Underfill

Capillary Underfill

Capillary Underfill (CUF)

Molded Underfill

Molded Underfill (MUF)