Please enable JavaScript to view this site.

Moldex3D Help 2021

Transfer molding encapsulates chips and prevent chips from being damaged by any external factor. Materials used in common are ceramics and plastics (Epoxy molding compound, EMC). Due to lower cost, transfer molding is a common encapsulation technology.

During transfer molding process, numerous issues should be considered, including: interconnection between microchips and other electronics (wire bonding), thermoset material curing, and various process conditions control. In addition, since all of the components (EMC, chip, leadframe…) have different materials and the wire density could be large in the cavity, common defects such as welding line, void, wire sweep, paddle shift and warpage could be very critical.


Process of transfer molding: First, the EMC is heated and flows into the cavity. After the cavity is fully filled, curing process starts.