Stress analysis is one of the most important numerical analysis in CAE applications. Stresses and strains in materials and structures are calculated under some boundary conditions (B.C.) like forces, loads, and displacements. Producers may want to apply stress analysis to realize the mechanical behaviors such as deformations or strength of their products under certain external circumstances like forces, temperature, displacements, etc. The mechanical behaviors of plastic products not only depend on mechanical properties of the material, but also strongly depend on manufacturing processes. In injection-molded plastic parts, some phenomena or defects caused by injection processes should be considered into subsequent stress analysis. These phenomena or defects include so called flow-induced residual stress (such as fiber orientation effect, molecular orientation effect and so on), thermal residual stress, weld lines, warpage, and so on. Stress analysis on plastic products without considering process-induced factors will lead to incorrect results.
Moldex3D provides Moldex3D Stress module which has the ability to consider the process-induced factors mentioned above. Also provides core shift and mold deformation analysis that can simulate part insert (or mold insert) and moldbase components deflection caused by pressure imbalance in filling. Because of simultaneous consideration to core deflection, cavity and moldbase mesh deformation effect, it can accurately predict insert object deflection in molding process and evaluate more comprehensively to set the filling condition of models with part inserts. The analytic results can determine the optimized gate locations and injection pressure to minimize the movement of mold cores and maximize core shift control. The moldbase components are taken into account while the analysis results of stress and displacement are under different molding conditions, furthermore the mold construction could be improved for minimizing the degree of deformation.
Moldex3D Stress allows users to perform linear stress analysis immediately after the completion of injection molding analysis. Stress analysis can be only carried out without other analysis results. However, if other analysis results exist, then some data like flow-induced residual stress can be considered as initial internal stress during stress analysis. Moldex3D Stress provides three types of steady-state boundary conditions (B.C.): force, pressure and displacement.
For core shift, Moldex3D enables users quickly and accurately analyze the interaction behavior of different components and further optimize product designs. To analyze core shift, there are two calculation methods: one is One-way, and the other is Two-way (FSI,Fluid-structure interaction), that can simulate real core deformation. In addition, the contact area between the insert and the melt, the layout of the insert and the flow path can also be taken into evaluation to measure the deformation. (Note that to perform Two-way (FSI), Stress license is a must).
For Mold deformation, Moldex3D offers users to create the all the mold components and accurately analyze the influence of different part. This module considers the effect of cavity pressure during filling stage and mold temperature distribution at end of cooling, that from various molding conditions, design of mold construction.
Moldex3D Stress can run linear and viscoelastic analysis to predict the warpage behavior and stress relaxation phenomenon after the annealing process for general cases. For IC encapsulation, post mold curing analysis (PMC) is implemented for annealing analysis, a function to analyze the warpage with the consideration of curing degree effect and thermal effect.
Note that Moldex3D Stress supports solid and eDesign mesh models. In addition, it supports the analysis on parts, part inserts and mold inserts.. The mold deformation only support standard cool analysis. In the following sections, the general procedures of stress function are demonstrated.